BERQUIST TGF 1500-00-60-400CC
Item #:
HE2166694
Product Info
HENKEL ELECTRONICS
BERGQUIST® GAP FILLER TGF 1500 is a two component, silicone thermally conductive, liquid gap filler. It features superior slump resistance and high shear thinning characteristics resulting in optimum consistency and control during dispense. It also exhibits excellent low and high temperature mechanical and chemical stability. It is therefore ideal for use between any heat source and sink. This product is curable at room temperature, however, the cure rate can also be accelerated with application of heat.
- Thermal conductivity: 1.8 W/mK
- Optimized shear thinning characteristics for ease of dispensing
- Excellent slump resistance (stays in place)
- Ultra-conforming with excellent wet-out for low stress interface applications