BERGQUIST® GAP FILLER TGF 3600
Item #:
HE2166508
Product Info
HENKEL ELECTRONICS
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra high thermal performance and superior softness. This product has low modulus to help relieves CTE stresses in thermal cycling and also provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.
- Thermal conductivity: 3.6 W/m-K
- Ultra low Modulus
- Ultra conforming
- Easily dispenable
- UL94 V-0 compliance