MP5405 50ML
Item #:
ASI-MP5405ML5
Product Info
AI-MP5405ML5, CYMP5405ML50, FRMP5405ML50
HB FULLER/CYBERBOND
ASI MP5405 50ML
MP5405 is a two part unfilled epoxy adhesive designed for ceramics, and most plastics. It cures to a tough semi-rigid material, and is a free flowing viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-byside dual cartridges for easy dispensing. Handling strength is normally achieved at room temperature within 3-5 minutes with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.