MP5405 FLEX 50ML
Item #:
ASI-MP5405FLEXML50
Product Info
AI-MP5405FLEXML50, CYMP5405FLEXML50, FRMP5405FLEXML50
HB FULLER/CYBERBOND
ASI MP5405 FLEX 50ML
MP 5405 FLEX is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-byside dual cartridges for easy dispensing.
A handling cure is normally achieved at room temperature within 20 – 30 minutes with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.